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GaN III Semiconductor Chip High Performance Electronic Component for Power Applications 3d model

GaN III Semiconductor Chip High Performance Electronic Component for Power Applications 3D model

-50%
$0.5
Version
Autodesk 3ds Max 2016
Polygons
4,513,002
Render
Corona
Size
228.50M
Textures
yes
Uploaded by
Em
Light
yes
Camera
yes
plug-in
Corona Physical Material
Published Date
Jul 16, 2025
Version
FBX 2016/2017
Polygons
4,513,002
Vertices
4,568,416
Uploaded by
Em
Size
263.67M
Textures
yes
Published Date
Jul 16, 2025
Polygons
4,513,002
Vertices
4,568,416
Size
102.18M
Uploaded by
Em
Textures
yes
Published Date
Jul 16, 2025
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